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  • SYS-521E-WR

SYS-521E-WR

2U UP WIO with 8 hot-swap 3.5" SAS/SATA (4 NVMe hybrid) bays and up to 5 PCIe 5.0 slots
Model : SYS-521E-WR
Product SKUs
SuperServer SYS-521E-WR
Motherboard
Super X13SEW-F
Processor
CPU
Core Count
  • Up to 52C/104T; Up to 300MB Cache
Note
  • Supports up to 300W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 1 double-width or 2 single-width GPUs
Supported GPU
  • NVIDIA PCIe: RTX 4500 Ada, RTX 5000 Ada, RTX A2000, RTX A4000, RTX A4500, RTX A5000, RTX A6000, T400
  • View GPU Options
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory
Memory
  • Slot Count: 8 DIMM slots/8 Channels
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe
Chipset
  • Intel® C741
Network Connectivity
Input / Output
LAN
  • 2 RJ45 1 GbE LAN ports
  • 1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1)
USB
  • 2 USB 3.2 Gen1 Type-A ports(rear)
  • 2 USB 2.0 Type-A ports(rear)
  • 2 USB 3.2 Gen1 ports(Header)
  • 1 USB 2.0 Type-A port(Header)
Video
  • 1 VGA port
Serial
  • 1 COM port(header)
  • 1 COM port(rear)
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-825B2TS-R0WNP
Dimensions and Weight
Height
  • 3.5" (89 mm)
Width
  • 17.2" (437 mm)
Depth
  • 25.5" (647 mm)
Package
  • 11" (H) x 26.5" (W) x 34" (D)
Weight
  • Gross Weight: 59 lbs (26.76 kg)
  • Net Weight: 34 lbs (15.42 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off 
  • System Reset
LED
  • Device Activity
  • LAN 1 Activity
  • LAN 2 Activity
  • Power Failure LED
  • Power status
  • System information
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 FHFL double-width slots
    • 2 PCIe 5.0 x8 LP slots
  • Option A*
    • 1 PCIe 5.0 x16 FHFL double-width slot
    • 2 PCIe 5.0 x8 FHFL slots
    • 2 PCIe 5.0 x8 LP slots
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays
    • 8 front hot-swap 3.5" SAS*/SATA drive bays
  • Option A: Total 8 bays
    • 4 front hot-swap 3.5" PCIe 5.0 x4 NVMe* drive bays
    • 4 front hot-swap 3.5" SAS*/SATA drive bays
  • (*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View NVMe Options
  • View Drive Options
M.2
Peripheral Bays
  • 2 2.5" bays (optional)
System Cooling
Fans
  • Up to 3 heavy duty PWM 80x80x38mm Fan(s)
Air Shroud
  • 1 Air Shroud
Power Supply
2x 1000W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 76 x 40 x 336 mm
Input 800W: 100-127Vac / 50-60Hz
1000W: 200-240Vac / 50-60Hz
1000W: 200-240Vdc / 50-60Hz
+12V Max: 66.7A / Min: 0A (100Vac-127Vac)
Max: 83A / Min: 0A (200Vac-240Vac)
Max: 83A / Min: 0A (200Vdc-240Vdc)
5V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
  1. Single Socket E (LGA-4677) 4th/5th Gen Intel®  Xeon® Scalable processors. Up to 300W TDP
  2. Intel® C741 Chipset
  3. 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
  4. Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN
  5. 8x front hot-swap 3.5" SATA3 drive bays (Optional 4 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
  6. Redundant Now Titanium 1000W Power Supplies

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