• AIE-KX11/12/21/22
  • AIE-KX11/12/21/22
  • AIE-KX11/12/21/22

AIE-KX11/12/21/22

• Supports NVIDIA Jetson AGX Orin™ 32GB/64GB module
• Up to 275 TOPS of AI performance
• Wide input voltage range from 9 to 36VDC
• 1 x M.2 B-Key/1 x E-Key/1 x M-Key slot
• 1 x GbE, 1 x 10GbE, and 2/4 x IEEE 802.3af GbE PSE ports
• Supports Innodisk Out-of-Band Remote Management Module
• Operating Temperature -25°C ~ +70°C
Model : AIE-KX11/12/21/22

● 8 x AI performance enables AI inference with low latency
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA® Jetson AGX Xavier™ 32GB module. Built in 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin 64GB module enables server-class AI inference at the edge with low latency.
● Comprehensive M.2 expansion and LAN ports
AIE-KX11/12/21/22 is a system with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. For network, on-board 2 or 4x PSE ports support 2 or 4x POE cameras, and 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.
● Wide input power and operating temperature for various embedded applications 

To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIE-KX11/12/21/22 supports operating temperature ranging from -25°C to 70°C and wide input power from 9 to 36VDC.

Model Number AIE-KX11 AIE-KX12 AIE-KX21 AIE-KX22
Module Compatibility NVIDIA Jetson AGX Orin 32GB NVIDIA Jetson AGX Orin 64GB
AI Performance 200 TOPS 275 TOPS
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores 2048-core NVIDIA Ampere GPU with 64 Tensor Cores
CPU 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
Memory 32 GB 256-bit LPDDR5 204.8 GB/s 64GB 256-bit LPDDR5 204.8 GB/s
Storage 64GB eMMC 5.1
Display 1 x HDMI 2.0 Type A
Audio Line-out / Line-in / Mic (optional with daughter board)
TPM TPM v2.0 (optional)
LAN 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port
PoE Interface 2 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
4 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
2 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
4 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
  *PSE Port 1 & Port 2 support IEEE 802.3at compliant; Total PSE ports support up to 60W
USB 2 x USB 3.2 Gen1 Ty pe A, 1 x OTG Ty pe-C, 1 x USB 3.2 Gen2 Ty pe-C, 1 x DB-15 USB 2.0
I/O Interfaces 2 x I2C,
1 x SPI,
5 x GPIO,
1 x RS-232,
1 x RS-422 / RS-485 (2-in-1),
2 x CAN 2.0b (isolation; support CAN FD),
2 x UART,
1 x microSIM Card Slot
Expansion 1 x M.2 B-Key 3042/3052 (LTE/4G/5G)
1 x M.2 E-Key 2230 (WiFi/BT)
1 x M.2 M-Key 2280 (supports NVMe; PCIe x2 Gen3)
1 x microSD Card Slot
MISC. Function 1 x Power / Recovery / Reset button
Power Input / Connector DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector
Power Consumption Idle: 14.3 W
Full Loading: 115.8* W
Idle: 14.8 W
Full Loading: 136.8* W
  *For more test condition information, please refer to user manual
Dimension (WxDxH) 220 x 170 x 79 mm (8.66 x 6.69 x 3.11 in)
Mounting Wall Mount (Optional) / Din Rail (Optional)
Net Weight 1.852 kg (4 lb)
Vibration 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis
Shock 10 G, IEC 60068-2-27, half sine, 11 ms duration
Temperature Operating Temp.: -25°C ~ +70°C (-13°F ~ +158°F) with 0.5 m/s air flow
Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F)
Humidity 95% @ 40°C (104°F) (non-condensing)
Software Support Linux (Support Jetpack 5.0 above)
Certification CE / FCC Class A / UKCA
• Supports NVIDIA Jetson AGX Orin™ 32GB/64GB module
• Up to 275 TOPS of AI performance
• Wide input voltage range from 9 to 36VDC
• 1 x M.2 B-Key/1 x E-Key/1 x M-Key slot
• 1 x GbE, 1 x 10GbE, and 2/4 x IEEE 802.3af GbE PSE ports
• Supports Innodisk Out-of-Band Remote Management Module
• Operating Temperature -25°C ~ +70°C

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